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Precision-engineered alloy materials for electronic packaging, aerospace, 5G, AI, and high-power electronics. Trusted by innovators worldwide since 2016.
Explore ProductsPioneering innovation in advanced alloy materials for high-tech industries.
Established in December 2016, we are dedicated to the research, development, production, and sales of cutting-edge alloy materials. In 2017, we introduced foreign alloy brazing material production equipment and established professional R&D centers for brazing materials and silicon-aluminum alloys.
Our high-clean gold-based alloy solders (Au80Sn20, Au88Ge12, Au96.85Si3.15), other alloy brazing materials (Ag72Cu28, SAC305, Sn63Pb37, In97Ag3, Bi58Sn42), pre-set gold-tin cap plates, and silicon-aluminum alloys (AlSi27, AlSi50, AlSi70, Al4047) have all reached international advanced levels.
We serve high-precision fields including electronic packaging, microwaves, aerospace, optical communications, 5G, artificial intelligence, new energy vehicles, and medical equipment — delivering professional, efficient, and reliable process solutions.
Precision-engineered solder preforms and aluminum silicon alloys for mission-critical applications.
Preform solder ribbon/sheet with high reliability for electronic packaging and optoelectronics.
High-temperature preformed solder with excellent thermal stability and low voiding.
High-purity preform solder sheet ideal for hermetic sealing in aerospace and medical devices.
Low-temperature, high-ductility preforms for cryogenic and flexible applications.
High-reliability paste for automated dispensing and reflow processes.
Precision spherical preforms for flip-chip and interconnect applications.
AlSi27, AlSi50, AlSi70, Al4047 with low CTE and high thermal conductivity.
Uniform composition, refined structure, low oxygen content for power electronics.
Hermetic sealing solution with high clean mirror finish and no oxidation.
Hybrid material combining high thermal conductivity with low weight.
Ag72Cu28, SAC305, Sn63Pb37, In97Ag3, Bi58Sn42 for diverse application needs.
High-strength, high-thermal-conductivity base for high-power semiconductor packaging.
Why Apex-New Material is the preferred partner for advanced alloy solutions.
Custom alloy development based on customer requirements and application needs.
Thinnest gold-tin solder sheet down to 7μm with high precision and consistency.
Dedicated mold department with low cost and fast turnaround for custom shapes.
Produce discs, frames, rectangles, circles, and complex non-standard shapes.
Mirror-effect surfaces with no oxidation, ensuring excellent wetting and bonding.
Imported equipment ensures uniform composition and low oxygen content.
Fast turnaround with some high-silicon aluminum models in stock.
Blue film, VR/waffle box, taping, glass bottle, plastic box options available.
Our advanced manufacturing process allows us to produce gold-tin solder sheets as thin as 7μm with high precision and consistency.
Yes, we specialize in R&D and can customize alloy compositions based on your specific thermal, mechanical, and reliability requirements.
We offer blue film, VR/waffle box, taping, glass bottle, and plastic box packaging to meet cleanroom and handling requirements.
Our materials are used in electronic packaging, aerospace, 5G, AI, optical communications, new energy vehicles, and medical equipment.
Yes, our stamping and mold capabilities allow us to produce discs, rectangles, frames, circles, and complex non-standard geometries.
For inquiries, quotes, or technical support, visit our official website to contact us directly.
Email: sales@apex-material.com
Support Email: postmaster@apex-newmaterial.com
Phone: (+86) 13982194280
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