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High-quality Flexible PCB, HDI PCB, Aluminum PCB, Rigid-Flex, High Frequency, Ceramic, and Multilayer PCBs for aerospace, automotive, medical, industrial, and consumer electronics.
Explore ProductsBeton Technology Co., Ltd. was established in Shenzhen in 2003. As a high-tech enterprise, we specialize in the manufacturing of Printed Circuit Boards (PCB) and PCB Assembly (PCBA). Our factory spans over 100,000㎡, enabling rapid production for prototypes, small batches, and mass production.
After decades of development, BETON has built a modern manufacturing facility for multilayer PCBs, HDI boards, flexible PCBs, rigid-flex PCBs, and full PCBA services. Our products are widely used in communication equipment, industrial control, automotive systems, medical devices, security electronics, consumer electronics, and aerospace applications.
Learn more on official site →
Why choose BETON for your PCB and PCBA needs?
ISO-certified processes and rigorous testing ensure every PCB meets international standards.
Quick lead times — single or double-layer PCBs delivered within 24 hours.
Professional CAM team for Gerber file optimization and design for manufacturability.
Low production cost control without compromising on quality or reliability.
Custom PCB & PCBA solutions for every industry
High-Density Interconnect technology for compact, high-performance electronics. Ideal for smartphones, wearables, and advanced computing devices.
High-Density
Designed for RF, microwave, and 5G applications. Low signal loss and stable dielectric properties for reliable high-speed transmission.
RF & Microwave
Flexible circuits in single, double, and multi-layer configurations. Perfect for dynamic flexing and space-constrained applications.
Flexible
Combines rigid and flexible substrates. Eliminates connectors and improves reliability in aerospace, medical, and military systems.
Hybrid Design
Metal-core PCBs with excellent thermal conductivity. Ideal for LED lighting, power supplies, and automotive lighting systems.
Thermal Management
High-performance ceramic substrate for extreme environments. Superior thermal and electrical insulation for power modules and sensors.
High-Temp
Advanced multilayer fabrication using latest HDI technologies. Supports complex routing and miniaturization in high-end electronics.
Multilayer
Full turnkey and consignment assembly services. From prototypes to mass production with strict quality control and traceability.
TurnkeyInsights and updates from the world of PCB technology
In semiconductor packaging, substrate materials directly affect performance and reliability. Learn how BT resins are shaping next-gen packaging.
Explore the evolution of HDI technology and how any-layer interconnects enable ultra-dense routing in modern electronics.
Understanding oxidation in BGA packaging and how proper storage, handling, and reflow profiles prevent defects.
Need a quote or technical support? Contact us directly through our official website.
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