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Advanced SMD packaging solutions with 15+ years of innovation. High-speed, reliable, and customizable automation for electronic component handling.
HJS Automation International Limited, based in Shenzhen — China’s technology capital — is a leading intelligent automation enterprise integrating R&D, production, sales, and service. We specialize in SMD component automatic packaging processing with over 15 years of expertise.
Our mission is to deliver high-precision, stable, and easy-to-maintain equipment that meets international quality standards. With a strong focus on innovation and customization, we serve industries including consumer electronics, automotive electronics, aerospace, lithium batteries, and precision manufacturing.
Wafer pick and place with die sorting and testing. HJS offers advanced solutions for SIP and CHIP manufacturing with high-accuracy automation.
Integrated into SMT production lines, our equipment ensures stable, reliable performance for high-throughput component packaging.
Complete packaging and taping solutions, including retaping and detaping processes for various SMD devices and connectors.
High-performance automation machines for every packaging need
Ideal for small to medium batch production with manual loading and automatic taping.
Converts tube-fed ICs into embossed carrier tape with high accuracy and speed.
Fully automatic system with bowl feeding for high-volume SMD packaging.
Efficiently transfers components from tubes to JEDEC trays with precision alignment.
High-speed taping with rotary tower assembly for consistent component orientation.
Automated conversion from tape & reel to JEDEC trays for downstream processing.
Repackaging solution for component recovery and re-taping with minimal damage.
Inductor testing with automatic sorting based on electrical parameters.
Measures the peel strength of cover tape to ensure packaging integrity.
ODM solutions tailored to your component specifications and production needs.
Long-term partnerships with global distributors and OEMs.
Continuous R&D investment in intelligent automation and precision engineering.
Over a decade of trusted experience in electronic packaging automation.
Our machines support a wide range of SMD components including ICs, resistors, capacitors, connectors, inductors, and more.
Yes, HJS Automation has strong ODM capabilities and can customize machines based on your unique component specifications.
Yes, our tape and reel solutions comply with EIA-481 and IEC standards for packaging and handling.
We offer technical support, remote assistance, training, and spare parts supply to ensure smooth operation.
Reach out for quotes, technical support, or partnership opportunities.
+86 15989403900
sales@hjsautomation.com
Shenzhen, China 518054
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