Electronic Component Packages Manufacturer

About Jitai

Jitai is a leading manufacturer of hermetic electronic packaging solutions, specializing in high-reliability components for mission-critical applications. With advanced production techniques and rigorous quality control, we serve industries where performance under extreme conditions is non-negotiable.

Our expertise spans metal-ceramic sealing, laser welding, parallel seam welding, and precision plating. Every product is engineered to meet or exceed international standards for hermeticity, thermal stability, and mechanical durability.

≤1×10⁻³

Pa·cm³/s Hermeticity

-55°C to 125°C

Temp Cycling

≥1×10¹⁰ Ω

Insulation Resistance

10,000g

Mechanical Shock

Our Product Range

Precision-engineered hermetic packages designed for reliability in aerospace, defense, telecommunications, and industrial systems.

Opto-Electronic Packages

• Hermeticity: ≤1×10⁻³ Pa·cm³/s
• Insulation: ≥1×10¹⁰ Ω (glass), ≥1×10⁹ Ω (ceramic)
• Flatness: ≤0.05mm
• Temp Cycling: -55°C to 125°C (20 cycles)

Power Packages

• Materials: 10# steel, oxygen-free copper, W-Cu
• Sealing: Laser or Parallel Seam Welding
• Insulation: ≥1×10¹⁰ Ω @ 500VDC
• Applications: High-power hybrid circuits

HIC Packages

• Materials: Kovar, Alloy42, CRS
• Lead Types: Cylindrical, Straight, Bent
• Layouts: DIP, Quad Inline
• Hermeticity: ≤1×10⁻³ Pa·cm³/s

Sensor Packages

• Hermeticity: ≤1×10⁻³ Pa·cm³/s
• Insulation: ≥1×10⁹ Ω
• Internal wire bonding compatible
• Solderable shell surface

TO Packages

• Standard Types: TO5, TO9, TO18, TO38, TO46, TO56, TO60, TO65
• Custom designs available
• Header + Cap configuration
• High thermal & electrical performance

Microwave Packages

• Frequency: 0–50 GHz
• VSWR: <1.2
• Impedance: 50Ω
• Applications: Radar, satellite comms, remote sensing

Ceramic Packages

• High thermal conductivity options
• Excellent dielectric properties
• Hermetic sealing with metal lids
• Suitable for high-frequency applications

SMD Packages

• Surface-mount compatible
• Miniaturized footprint
• High reliability under thermal cycling
• Ideal for automated assembly lines

Gold-Tin Preformed Lids

• Eutectic AuSn (80/20) alloy
• Low voiding, high thermal conductivity
• Precise thickness and diameter control
• Ideal for hermetic sealing

SMP/RF Feedthroughs

• High-frequency signal transmission
• Hermetic sealing up to 50 GHz
• Low insertion loss
• Custom impedance matching

View All Products on Official Site

Why Choose Jitai?

Hermetic Reliability

All packages tested to ≤1×10⁻³ Pa·cm³/s leak rate, ensuring long-term performance in harsh environments.

Thermal Stability

Engineered for extreme thermal cycling (-55°C to 125°C) and high-power dissipation applications.

Custom Engineering

R&D team supports custom designs, including non-standard TO packages and specialized feedthroughs.

Industrial Applications

Trusted in aerospace, defense, telecom infrastructure, and high-reliability industrial systems.

Frequently Asked Questions

What is hermetic packaging?

Hermetic packaging refers to enclosures that are airtight and prevent the ingress of moisture, gases, or contaminants. This is critical for long-term reliability in harsh environments such as aerospace, defense, and industrial applications.

What materials do you use?

We use a range of materials including Kovar, Alloy42, 10# steel, oxygen-free copper, tungsten-copper, and zirconium copper. Ceramic substrates and gold-tin preforms are also used for sealing.

Can you customize TO packages?

Yes, our R&D team works closely with clients to develop custom TO headers, caps, and lead configurations beyond standard TO5, TO18, TO46, etc.

What industries do you serve?

We serve aerospace, defense, telecommunications, medical devices, industrial sensors, and high-reliability electronics sectors.

Do you offer testing data?

Yes, each batch undergoes rigorous testing for hermeticity, insulation resistance, thermal cycling, and mechanical shock. Test reports are available upon request.

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Precision Hermetic Packaging for Demanding Environments