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Lori is a global innovator in trusted thermal solutions that make computing and data center products better, safer, faster, and more reliable. From AI servers to quantum computing, we deliver high-performance air and liquid cooling systems engineered for extreme efficiency.
Reliable cooling solutions for data centers, AI, HPC, and enterprise infrastructure
Innovative thermal management for the most demanding environments
Lori CPU coolers provide air cooling solutions for various CPU motherboards, sockets, and servers. Choose from down pressure coolers, tower coolers, and more. Easy to install, highly efficient, and designed for continuous operation.
Connect cold plates, radiators, and pumps into a seamless direct-to-chip liquid cooling system. Customizable for data centers, AI servers, and supercomputers. Optimized for space and maximum heat dissipation.
Core component of direct chip cooling. Efficiently removes heat from CPUs, GPUs, and memory modules. Available in copper and aluminum variants with micro-channel design for superior thermal conductivity.
Comprehensive cooling solutions for every computing need
High-efficiency air cooler for Intel 12th-14th Gen processors. Skived fin design, 6 heat pipes, low noise operation.
Passive and active variants for EPYC processors. Designed for 2U/4U server integration with high airflow efficiency.
Compact direct-to-chip solution for high-density data centers. Includes cold plate, tubing, and quick-disconnect fittings.
Designed for Intel Xeon Scalable processors. High-performance aluminum heatsink with optimized fin density.
Custom cold plates for high-power GPUs. Compatible with NVIDIA and AMD data center accelerators.
Precision-machined aluminum or copper fins for maximum surface area. Ideal for high-power density applications.
Optimized for AMD Ryzen 7000 series. Low-profile design for SFF builds with excellent thermal performance.
Advanced two-phase cooling for extreme thermal loads. Used in AI training servers and HPC clusters.
Precision engineering behind every thermal solution
Efficient heat transfer directly from chip to coolant with minimal thermal resistance.
High-density aluminum or copper fins machined from a single block for maximum conductivity.
Two-phase cooling systems that spread heat rapidly across large surface areas.
High-reliability solder joints ensure long-term thermal performance and durability.
Lori is a global innovator in trusted thermal solutions that empower the world’s most advanced data centers, AI servers, and high-performance computing systems. With over 15 years of experience, we specialize in air and liquid cooling technologies that maximize performance, safety, and reliability.
From concept to prototyping to mass production, Lori delivers customized thermal solutions with precision engineering and quality assurance at every step. Our products are designed for extreme efficiency and long-term durability in mission-critical environments.
Lori supports a wide range of sockets including Intel LGA 1700, 4677, 4189, 3647, and AMD AM4, AM5, SP3, SP5, SP6, and SP7.
Yes, Lori provides full custom design, prototyping, and manufacturing services for air and liquid cooling systems tailored to your specific requirements.
Yes, all our liquid cooling systems are rigorously tested to ensure leak-free operation under high pressure and continuous use.
Standard lead time is 4-6 weeks for production and quality testing. Expedited options are available upon request.
Ready to optimize your thermal performance? Contact Lori today for custom solutions, samples, or technical support.
All inquiries and requests are handled through the official website.
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