Shenzhen HC Technology Co., Ltd. | Advanced Thermal Interface Materials & Solutions

About Shenzhen HC Technology

Shenzhen HC Technology Co., Ltd. is a professional company dedicated to the development, production, and sales of thermal interface materials. As one of the excellent thermal conductive material suppliers in China, we provide comprehensive thermal management solutions for industries such as electronics, automotive, LED lighting, telecommunications, and renewable energy.

Our product line includes high thermal conductivity silicone pads, thermal grease (paste), thermal conductive adhesive tapes, natural and pyrolytic graphite sheets (PGS), RTV-1 and RTV-2 thermal sealants, copper and aluminum foil tapes, and more. We welcome OEM and ODM projects and are committed to delivering superior product quality and timely after-sales service.

ISO 9001:2008 Certified RoHS Compliant REACH Certified UL 94VO Rated

Our Product Range

Discover our full line of high-performance thermal interface materials engineered for reliability, efficiency, and long-term stability.

Thermal Conductive Silicone Pad

High thermal conductivity, electrically insulating, soft and compressible. Ideal for CPU/GPU cooling, power modules, and LED drivers.

• Conductivity: 1.0–8.0 W/mK
• Thickness: 0.2–5.0 mm
• Dielectric Strength: >5 kV

Thermal Grease (Paste)

High-performance thermal compound with excellent wetting and long-term stability. Used in CPUs, GPUs, and power semiconductors.

• Conductivity: 3.0–12.0 W/mK
• Low volatility, non-settling
• Operating Temp: -50°C to 200°C

Thermal Conductive Adhesive Tape

Double-sided tape with high thermal transfer and strong adhesion. Perfect for heat sinks, sensors, and PCB mounting.

• Conductivity: 1.5–4.0 W/mK
• Peel Adhesion: >10 N/cm
• Thickness: 0.1–0.5 mm

RTV-1 Thermal Adhesive Sealant

One-component silicone sealant that cures at room temperature. Offers excellent thermal transfer and environmental protection.

• Conductivity: 1.0–3.0 W/mK
• Cures in 24h @ 25°C
• UL 94VO Flame Rating

RTV-2 Thermal Potting Sealant

Two-part silicone potting compound for encapsulating high-power electronics. Provides thermal conductivity and mechanical protection.

• Conductivity: 1.5–5.0 W/mK
• Shore A: 30–50
• Low shrinkage, high flexibility

Copper Foil Tape

Highly conductive copper tape with acrylic adhesive. Used for EMI shielding, grounding, and thermal spreading.

• Thickness: 0.03–0.1 mm
• Conductivity: >90% IACS
• Adhesive: Pressure-sensitive

Thermal Graphite Sheet (PGS)

Pyrolytic graphite sheet with ultra-high in-plane thermal conductivity. Ideal for smartphones, tablets, and wearable devices.

• Conductivity: 300–1500 W/mK (in-plane)
• Thickness: 0.1–0.3 mm
• Flexible, lightweight

Aluminum Foil Tape

Durable aluminum tape with strong adhesive. Used for HVAC insulation, thermal shielding, and cable wrapping.

• Thickness: 0.05–0.1 mm
• Reflectivity: >95%
• UV and moisture resistant

Nano Carbon Copper Foil

Advanced composite foil with enhanced thermal and electrical conductivity. Designed for high-efficiency thermal transfer.

• Conductivity: 2.5–6.0 W/mK
• Nano-coated surface
• Anti-oxidation layer

Silicone Cloth Series

Heat-resistant silicone-coated fiberglass cloth. Used in high-temp insulation, fire protection, and industrial sealing.

• Temp Range: -70°C to 260°C
• Flame Retardant
• High Tensile Strength

Why Choose HC Technology?

We combine innovation, quality, and customer focus to deliver reliable thermal management solutions worldwide.

Quality Assured

Our quality management system complies with ISO 9001:2008. All materials are eco-friendly and meet RoHS, REACH, and UL 94VO standards.

High Performance

Engineered for maximum thermal efficiency, our materials ensure optimal heat dissipation and long-term reliability in demanding environments.

Customer Focused

We listen to your needs and offer OEM/ODM services, fast prototyping, and responsive after-sales support trusted by clients worldwide.

Frequently Asked Questions

What are thermal interface materials (TIMs)?

Thermal interface materials are used to fill microscopic air gaps between heat sources (like CPUs) and heat sinks. They improve thermal transfer by replacing air (a poor conductor) with a material of higher thermal conductivity.

Can I request custom sizes or formulations?

Yes, we welcome OEM and ODM projects. Our R&D team can customize thickness, shape, thermal conductivity, and adhesive properties to meet your specific application requirements.

Are your products RoHS and REACH compliant?

Yes, all our materials are eco-friendly and fully compliant with RoHS, REACH, and UL 94VO standards. Certifications are available upon request.

What is the lead time for samples and bulk orders?

Sample delivery: 3–5 business days. Bulk production: 7–15 days depending on order size. We offer fast global shipping via DHL, FedEx, or UPS.

Do you provide technical support?

Yes, our engineering team provides full technical support, including material selection, application guidance, and troubleshooting.

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Advanced Thermal Interface Materials for High-Performance Applications