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Premium silicone thermal pads, heat sink interface materials, phase change materials, and high-conductivity thermal management products engineered for performance, reliability, and durability across industrial, automotive, and electronics applications.
Explore ProductsThermazig is a leading manufacturer and supplier of high-performance thermal interface materials based in China. We specialize in developing advanced thermal solutions for industries ranging from consumer electronics and automotive to industrial systems and telecommunications.
Our product line includes silicone thermal pads, CPU thermal pads, thermal graphite sheets, phase change materials (PCM), thermally conductive tapes, and potting compounds—all designed to ensure optimal heat dissipation, electrical insulation, and long-term reliability.
Discover our wide range of high-conductivity, customizable thermal interface materials trusted by global manufacturers for performance and reliability.
Ideal for automotive engine control units. High thermal conductivity, compressible, and durable under extreme conditions.
Ultra-high conductivity pad for micro heat pipe and high-density electronics cooling.
Widely used in LED TVs and lamps. Garnet-infused for enhanced heat transfer and stability.
Designed for GPU, CPU, and LED cooling. Operates from -40°C to 200°C.
Flexible carbon-based thermal pad for smartphones and compact electronics.
Thermal pad that changes phase at operating temperature for optimal interface contact.
Pink silicone pad with high dielectric strength for semiconductor cooling.
Adhesive thermal tape for secure mounting of heatsinks and components.
Engineered for performance, tested for reliability, trusted by global partners.
Materials with up to 13.0 W/mK thermal conductivity for maximum heat transfer efficiency.
Rigorous QC processes and factory audits ensure every batch meets international standards.
Die-cut, roll, or sheet formats tailored to your exact thickness, shape, and conductivity needs.
Trusted by partners in Europe, Asia, and North America for consistent quality and on-time delivery.
Thermal pads are used to fill air gaps between heat-generating components (like CPUs, GPUs) and heat sinks. They improve thermal conductivity and prevent overheating.
Higher W/mK values mean better heat transfer. For standard electronics, 3–6 W/mK is sufficient. High-performance systems may require 8–13 W/mK materials.
Yes. We offer custom die-cutting, thickness adjustment (0.25–5.08mm), and conductivity tuning based on your application needs.
Phase Change Materials (PCM) soften at operating temperature to fill micro-gaps, offering lower thermal resistance. Silicone pads are solid and provide structural support and insulation.
Yes, all our thermal interface materials meet RoHS and REACH environmental standards.
Have a project or need a custom thermal solution? Contact us directly through our official website.
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